22nd Microoptics Conference (MOC 17)

Topics: Nanotechnology, Materials Science, Analytical Chemistry, Physical Chemistry, Keywords: see below

Date: /19/20/21/22/ November 2017, Tokyo, Japan, Asia

Web Site, Contact: moc2017 [at] or.knt.co.jp


Official Information:

The 22nd MICROOPTICS CONFERENCE (MOC2017) will be held at INSTITUTE of INDUSTRIAL SCIENCE, THE UNIVERSITY of TOKYO, Tokyo, Japan on November 19 - November 22, 2017.
This conference is sponsored by the Japan Society of Applied Physics (JSAP) and organized by Microoptics Group, JSAP and in cooperation with several academic societies and associations.


1)Theory, Modeling, and Design
Aberrations, Dispersion, Beam optics, Guided-wave optics, Gradient-index optics, Diffractive optics, Photonic band, Slow light, Near-field optics, Nonlinear optics, Thermooptics, Plasmonics, Metal optics, Quantum optics/photonics, Biomimetic optics, Simulation and system design, etc.

2)Materials and Fabrication
Semiconductors, Crystals, Dielectric materials, Polymers, Liquid crystals, Nonlinear materials, Composite materials, Nano-materials, Transparent conductors, Magneto-optic materials, Spin-materials, Metamaterials, Nanocarbons, etc.
Micro- and nano-fabrication, Nano-imprint, Laser processing, Heterogeneous bonding, 3D printing, etc.

3)Measurement and Sensing
Spectroscopy, Interferometry, Reflectometry, Ultrafast measurement, 3D measurement, Quantum measurement, etc.

4)Passive Devices
Fibers, Waveguides, Multi/Demultiplexers, Add-drop multiplexers, Branching and mixing components, Photonic crystals, Filters, Microlenses, Diffractive optical elements, Isolators, Polarizers, etc.

5)Dynamic and Functional Devices
MEMS, Switches, Modulators, Tunable devices, Wavelength converters, Nonlinear optical devices, Deflectors, Optical buffers, etc.

6)EO/OE and Active Devices
Lasers, LEDs, VCSELs, Array lasers, Amplifiers, Photo detectors, Terahertz devices, Optical imaging sensors, Solar cells, Energy harvesting devices, etc.

7)Integration, Packaging, and Si photonics
Monolithic and hybrid integration, Mounting and packaging, Micro-assembly, Wafer-level assembly, 3D integration, etc.